Our newly installed Electroless Nickel Immersion Gold (ENIG) plating line, will enhance the quality of our ENIG finish and increase our ENIG plating capacity substantially. The ENIG process plates 0.1 microns of gold over 5 microns of nickel upon the exposed copper pads of a PCB, giving a very flat and robust finish upon which to solder surface mount components. We are continuously planning ahead and investing in some of the latest equipment and processes.
With proving trials planned over the next few weeks, our new ENIG line will soon be into full production.
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